OPTICAL_PHYSICS · ROL-0005
Photonic Packaging & Fibre-Coupling Engineer
Packaging is where most photonic systems lose their margin. You own the optical and electrical interface from die to package: fibre attach, mode matching, thermal management and post-package verification.
OpenFull-TimeIslamabad, PK
SPECIFICATION
- DEPARTMENT
- Packaging & Assembly
- DOMAIN
- Optical Physics
- ARRANGEMENT
- Full-Time
- AVAILABILITY
- 1-3 Months
- LOCATION
- Islamabad, PK
- REMOTE
- On-site
- COMPENSATION
- PKR 200,000 – 320,000 / month
- POSTED
- 2026-02-11
- REFERENCE
- ROL-0005
RESPONSIBILITIES
- Design and qualify fibre-to-chip coupling: edge coupling, grating coupling and mode-field matching.
- Own the attach process — alignment, curing, underfill and mechanical tolerance stack-up.
- Define the electrical escape route and manage thermal paths for the optical engine.
- Qualify packages for thermal cycling, shock and long-run stability.
- Instrument the assembly step so we can see yield loss as it happens.
REQUIRED_TOOLING
PythonKLayout
WHAT WE NEED TO SEE
- Understanding of optical mode profiles and coupling loss mechanisms.
- Practical laboratory skill: alignment stages, adhesives, microscopy.
- Statistical thinking about process yield.
ADVANTAGEOUS
- Active alignment experience.
- Knowledge of co-packaged optics or chiplet integration.
- Mechanical or thermal simulation exposure.